Boron Carbide Etch Ring: A critical component for semiconductor etching equipment made from boron carbide (B₄C). It features extremely high hardness and wear resistance, strong chemical inertness, and excellent thermal stability. It can operate reliably in highly reactive plasma environments, ensuring dimensional precision and process consistency.
Semiconductor Etching Process: Used as a critical component inside the etching chamber to assist in wafer positioning and maintain plasma density. It helps prevent sidewall contamination of the wafer, and its resistance to plasma bombardment ensures process accuracy, thereby improving chip manufacturing yield.
