| Property | Unit | Value |
|---|---|---|
| Density | g/cm³ | 3.3 |
| Mohs Hardness | — | 7–8 |
| Flexural Strength | MPa | 300–400 |
| Melting Point | °C | >2200 (decomposes in N₂) |
| Maximum Service Temperature | °C | ~1350 (in air) |
| Thermal Conductivity (20°C) | W/(m·K) | 140–180 |
| Thermal Expansion Coefficient | K⁻¹ | 4.5×10⁻⁶ – 5.0×10⁻⁶ |
| Volume Resistivity (20°C) | Ω·cm | >10¹⁶ |
| Dielectric Strength | kV/mm | 15–20 |
| Dielectric Constant (1 MHz) | — | 8.5–9.0 |
High-Temperature Crucibles: Used for high-temperature melting and sintering processes. They provide excellent resistance to heat and corrosion, preventing material contamination.
IC Packaging Substrates / Heat Sinks: Used for chip packaging heat dissipation and circuit routing. They reduce junction temperature and improve device stability and reliability.
Semiconductor Equipment Components: Used as structural and insulating support parts in high-temperature and vacuum equipment, offering high-temperature resistance and contamination prevention.
High-Power LED Substrates: Used for LED thermal management and electrical insulation. They provide efficient heat dissipation, reduce light decay, and extend device lifespan.
