| Property | Unit | Value |
|---|---|---|
| Density | g/cm³ | 3.6–3.9 |
| Mohs Hardness | — | 9 |
| Flexural Strength | MPa | 300–400 |
| Compressive Strength | MPa | 2000–3000 |
| Melting Point | °C | ~2050 |
| Maximum Service Temperature | °C | 1500–1750 |
| Thermal Conductivity (20°C) | W/(m·K) | 18–36 |
| Thermal Expansion Coefficient | K⁻¹ | 7.0×10⁻⁶ – 8.0×10⁻⁶ |
| Volume Resistivity (20°C) | Ω·cm | >10¹⁴ |
| Dielectric Strength | kV/mm | 10–35 |
| Dielectric Constant (1 MHz) | — | 9–10 |
High-Temperature Crucibles / Sintering Containers: Used for semiconductor material sintering and melting. They offer high-temperature resistance, corrosion resistance, reduced contamination, and ensure material purity.
Semiconductor / LED Packaging Substrates: Provide high electrical insulation and thermal conductivity for chips, enabling efficient heat dissipation and improving device stability and lifespan.
Semiconductor Equipment Structural Components / Fixtures Used for support and positioning in vacuum and high-temperature equipment. They are resistant to high temperatures and plasma corrosion, ensuring long-term stability.
Vacuum / High-Temperature Furnace Insulation Components: Used for electrical insulation in process furnaces. They provide high-temperature resistance and anti-aging performance, ensuring safe and stable equipment operation.
Wafer Carriers / Processing Fixtures: Used for wafer handling and positioning during processing and transfer, reducing wear and contamination while improving process yield.
