Point Source

A point evaporation source is a key component used in physical vapor deposition (PVD) processes. It locally heats the source material to induce evaporation from a confined point, allowing it to condense and form thin films on a substrate. This type of evaporation source is known for its high precision and controllability and is widely used in industrial applications requiring fine coatings. Its design is typically based on electron beam or resistive heating principles, ensuring a stable and efficient evaporation process.

Characteristic

Excellent Stability: Uses high-quality materials and precision control circuits to ensure stable evaporation rate and temperature during long-term operation, minimizing process fluctuations.

Good Uniformity: The point-source design enables precise control of evaporation angle and distribution, achieving highly uniform thin-film thickness suitable for demanding coating applications.

High Material Utilization Efficiency: Optimized heating zone design reduces material waste, with utilization efficiency typically exceeding 80%, helping to lower production costs.

Strong Compatibility: Supports evaporation of various materials, including metals, alloys, and compounds, meeting diverse process requirements.

Parameter

Property Unit Value
Evaporation Rate Å/s 0.1–10 (adjustable)
Power Range W 100–5000
Temperature Control Accuracy °C ±1
Material Compatibility Al, Ag, Mg, Yb, Cu, In, Ga, etc.
Vacuum Requirement mbar Base pressure ≤ 1×10⁻⁶
Service Life >1000 hours (depending on material and usage conditions)

Application field solutions

OLED Evaporation: Provides precise evaporation of organic emissive materials to form uniform organic functional layers, ensuring device efficiency and high yield.

CIGS Thin-Film Evaporation: Enables uniform deposition of copper–indium–gallium–selenide (CIGS) semiconductor materials to form high-efficiency solar cell absorber layers.

Perovskite Evaporation: Provides controllable evaporation for perovskite photovoltaic materials, enabling high-quality thin-film formation and improving cell efficiency and stability.

Thin-Film Deposition for Research Applications: Meets laboratory requirements for thin-film fabrication of various advanced materials, supporting nanometer-scale thickness control and process parameter optimization.

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