A key functional component in semiconductor process systems, primarily used in wafer processing, vacuum deposition, and precision temperature control during critical manufacturing steps.
Characteristic
High Purity and Low Contamination: Suitable for ultra-clean semiconductor process environments, effectively reducing impurity contamination risks.
Precision Temperature Control Performance: Provides stable thermal field control, improving process uniformity and stability.
Excellent High-Temperature Resistance: Capable of operating in high-temperature vacuum and continuous process environments with long-term stability.
Good Structural Stability: Maintains dimensional and performance stability under complex operating conditions.
Compatibility with Vacuum and Plasma Environments: Suitable for high vacuum, plasma, and thin-film deposition systems.
Parameter
Application field solutions
Thin Film Deposition System: Point sources and linear sources for PVD, evaporation coating and thin film growth processes.
Wafer Holding & Transport System: Electrostatic Chucks (ESC) for wafer carrying and control systems.
Semiconductor Heating System: For high-temperature heating, thermal field control and temperature homogenization processes.
Vacuum & Etching Equipment: Applicable to vacuum deposition, plasma etching and related semiconductor equipment environments.
