Ultra-High Purity
Exceptional Thermal Stability
Ultra-Low Outgassing
Excellent Corrosion and Contamination Resistance
| Property | Unit | Value |
|---|---|---|
| Density | kg/m³ | 2.2×10³ |
| Hardness (Mohs) | — | 5.5–6.5 |
| Tensile Strength | MPa | 48 |
| Compressive Strength | Pa | >1.1×10⁹ |
| Bulk Modulus | Pa | 3.7×10¹⁰ |
| Shear Modulus | Pa | 3.1×10¹⁰ |
| Young’s Modulus | Pa | 7.2×10¹⁰ |
| Poisson’s Ratio | — | 0.17 |
| Thermal Expansion Coefficient (20–320°C) | K⁻¹ | 5.5×10⁻⁷ |
| Thermal Conductivity (20°C) | W/(m·K) | 1.4 |
| Specific Heat (20°C) | J/(kg·K) | 670 |
| Softening Point | °C | 1683 |
| Annealing Point | °C | 1215 |
| Deformation Point | °C | 1120 |
| Electrical Resistivity (350°C) | Ω·cm | 7×10⁷ |
Semiconductor Microelectronics Industry: Serves as a key component in high-temperature process equipment, providing a high-purity, heat-resistant, and low-contamination environment for wafer manufacturing.
Photovoltaic Industry: Acts as a core consumable in crystalline silicon solar cell production, ensuring process stability and product purity in high-temperature crystal pulling, diffusion, and sintering processes.
LED Optoelectronics Industry: Provides high-purity and high-temperature-resistant process support for LED epitaxial growth and chip fabrication, preventing impurity contamination that could reduce luminous efficiency.
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