Electrostatic Chuck (ESC)

Product Overview

Electrostatic Chuck: An electrostatic chuck (ESC) operates based on electrostatic adsorption principles and consists of an electrode layer, insulating layer, substrate, and temperature-control gas channels. By applying voltage, an electrostatic field is generated to securely hold the workpiece. It offers non-contact clamping, uniform holding force, compatibility with vacuum and wide temperature ranges, and integrated thermal control capability. It is a key component in advanced manufacturing, serving as a replacement for traditional mechanical clamping systems.

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Product Details

Semiconductor Manufacturing: Used to secure wafers during lithography, etching, and other processes, improving device yield and process stability.

Display Panel Production: Used for substrate fixation and film protection, ensuring high precision in OLED and Micro-LED manufacturing processes.

Photovoltaic Manufacturing: Used to hold silicon wafers or thin-film substrates, compatible with coating and cutting processes.

Precision Electronics Processing: Provides precise positioning for microchips and ceramic substrates, supporting high-accuracy assembly.

Scientific Research and Special Processing: Used for fixing micro-samples or specialized workpieces in characterization experiments and laser processing applications.

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