PBN - Pyrolytic Boron Nitride

Pyrolytic Boron Nitride (PBN) is a type of advanced ceramic material. The deposition process of PBN is like "snowfall"—tiny hexagonal boron nitride flakes deposit parallel to the substrate one after another. After reaching a specific thickness, the final product is formed by cooling and demolding.

Characteristic

High Purity & Density: With a purity of over 99.999%, it features a dense, pore-free surface, excellent hermeticity, and an extremely low helium permeability of 1×10⁻¹⁰ cm³/s.

High Temperature Resistance & Thermal Properties: It withstands temperatures up to 2200℃, with its strength increasing as temperature rises. It exhibits exceptional thermal shock resistance and anisotropic thermal conductivity (60 W/m·K in the a-direction at 200℃, and only 2.60 W/m·K in the c-direction).

Chemical Inertness: It is resistant to corrosion by acids, alkalis, salts, and organic reagents, and demonstrates non-wetting behavior and no reactivity with most molten metals and semiconductor materials.

Electrical & Special Properties: It possesses high electrical resistivity (2.4×10¹⁵ Ω·cm), high dielectric strength (56 KV/mm at room temperature), a low dielectric constant, and a low dielectric loss tangent, along with excellent transmissivity to microwaves and infrared radiation.

Anisotropy & Mechanical Properties: It shows pronounced anisotropy in mechanical, thermal, and electrical properties, with a tensile strength of 102 N/mm² and a bending strength of 243 N/mm².

Parameter

Properties Unit Value
Density g/cm³ 1.95–2.20
Tensile Strength N/mm² 102
Flexural Strength N/mm² 243
Compressive Strength N/mm² 244
Thermal Conductivity (200°C) W/(m·K) 60 (a) / 2.60 (c)
Thermal Expansion Coefficient (200°C) K⁻¹ 2.0 × 10⁻⁶ (a)
Dielectric Constant (Room Temperature) 5.81
Electrical Resistivity Ω·cm 2.4 × 10¹⁵

Application field solutions

Semiconductor Crystal Growth: Used as crucibles for the LEC, VGF, VB, and MBE methods in the growth of III-V compound semiconductor single crystals such as GaAs, InP, and GaP. Its high purity and chemical inertness prevent melt contamination.

OLED Evaporation Sources: Used as evaporation crucibles and support frames in OLED production, providing high insulation, high-temperature stability, and outgassing-free performance.

High-Temperature Protective Coatings: Applied as PBN coatings on graphite heaters, graphite crucibles, etc., to prevent high-temperature volatilization and contamination.

Special Metallurgy & Melting: Used as crucibles for high-purity metal evaporation coating and melting, resistant to and non-reactive with various molten metals.

Electronic Devices & Windows: Used in traveling wave tube (TWT) support rods, MOCVD insulation plates, and infrared/microwave transmission windows, utilizing its insulation, wave-transmission, and high-temperature stability properties.

Aerospace & Vacuum Equipment: Used as insulation components in high-temperature vacuum furnaces, high-temperature insulating fluid nozzles, etc., to meet requirements for thermal insulation, electrical insulation, and structural stability under extreme environments.

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