Aluminum Nitride Crucible: A high-temperature resistant container made from high-purity aluminum nitride powder. It features high thermal conductivity, excellent high-temperature resistance, strong chemical inertness, low dielectric properties, and outstanding electrical insulation. Its thermal expansion coefficient is well matched with silicon, while also offering low contamination and excellent thermal shock resistance, making it suitable for high-temperature applications requiring efficient heat transfer and high material purity.
Semiconductor and Electronics Applications: Used for chip packaging sintering, wafer annealing, and electronic ceramic sintering. Its high thermal conductivity ensures uniform temperature control, while low contamination helps maintain material purity.
Non-Ferrous Metal Melting: Suitable for small-scale melting of reactive metals such as aluminum and magnesium. Its chemical inertness prevents unwanted reactions, ensuring metal purity and improving melting efficiency.
High-Temperature Laboratory and Materials Synthesis: Applied in high-temperature melting tests and nitride ceramic synthesis. Excellent thermal shock resistance and high-temperature stability ensure reliable experimental performance, while high purity minimizes material contamination and compositional interference.
