Boron Carbide Etching Ring is a key component for semiconductor etching equipment, made from boron carbide (B₄C) ceramic. It features high hardness and wear resistance, strong chemical inertness, and excellent thermal stability, enabling stable operation in highly reactive plasma environments while maintaining dimensional precision and process consistency.
Applications:
Semiconductor Etching Processes:Serves as a critical component within the etching chamber, helping to secure wafer positioning and maintain plasma density. It prevents contamination of wafer edges and, due to its resistance to plasma bombardment, ensures precise etching, thereby improving chip manufacturing yield.
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