High-Temperature Insulation and Heat Dissipation: Used as insulating partitions in high-temperature furnaces and heat dissipation substrates for electronic components. Its high thermal conductivity enables efficient heat transfer, while excellent electrical insulation ensures operational safety in harsh high-temperature environments.

Metal Processing and Forming: Applied as mold liners and casting guide plates for molten metals such as aluminum and copper. Its chemical inertness prevents reactions with molten metals, while non-wetting properties reduce material residue and improve forming precision.

Semiconductor and Electronics Applications: Serves as high-temperature insulating platforms and RF component insulating liners in semiconductor manufacturing processes. Low dielectric loss and excellent electrical insulation make it suitable for high-frequency and high-temperature electronic environments, ensuring process stability.

Laboratory and Materials Synthesis: Used as high-temperature reaction trays and sample support plates in laboratory applications. Its thermal shock resistance and chemical stability ensure safe operation and prevent contamination of reaction materials.