Applications:

High-Temperature Insulation and Heat Dissipation：Used as insulating plates inside high-temperature furnaces and as heat-dissipating substrates for electronic components. Its high thermal conductivity enables efficient heat dissipation, electrical insulation ensures safe operation, and high-temperature resistance adapts to harsh working environments.

Metal Processing and Forming：Serves as forming mold liners or flow-guiding plates for molten metals such as aluminum and copper. Chemical inertness prevents reactions with metals, and non-stick properties reduce residue, ensuring precise product forming.

Semiconductor and Electronics：Acts as an insulating platform in high-temperature semiconductor processes and as insulating liners for RF components. Low dielectric loss and high insulation suit high-frequency and high-temperature electronic environments, ensuring process stability.

Laboratory and Material Synthesis：Used as trays or sample carriers for high-temperature laboratory reactions. Thermal shock resistance and chemical stability ensure experimental safety and prevent contamination of reactants.