PBN/PG Composite Heating Plate is a layered composite plate combining the stable protective properties of PBN with the high-efficiency heating characteristics of PG, featuring a “PBN–PG–PBN” structure.
This plate offers both efficient heating and stable protection, with excellent temperature uniformity, low outgassing, and a dense structure. It can operate reliably for long periods under demanding conditions such as ultra-high vacuum or inert atmospheres.
Applications:
Semiconductor Substrate Heating:Provides precise temperature control and thermal conduction in MBE, MOCVD, and other processes, ensuring stable substrate temperatures and improving device yield and performance.
Advanced Material Preparation:Used for processing superconductors, functional thin films, and other high-performance materials. The PBN’s anti-contamination properties support both research and mass production.
Research and Laboratory Experiments:Delivers high-precision heating for high-temperature testing in electron microscopy and material characterization, meeting strict requirements for temperature control and purity.
High-Purity Material Handling:Applied in preheating OLED materials or annealing high-purity metals, preventing contamination and ensuring product purity.
Specialized Electronic Device Manufacturing:Used for heating and curing prior to device packaging, providing low-interference temperature control to avoid damaging sensitive structures and maintain stable electrical performance.
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