PBN Crucibles

Characteristic

High Purity & Density: With a purity of over 99.999%, it features a dense, pore-free surface, excellent hermeticity, and an extremely low helium permeability of 1×10⁻¹⁰ cm³/s.

High Temperature Resistance & Thermal Properties: It withstands temperatures up to 2200℃, with its strength increasing as temperature rises. It exhibits exceptional thermal shock resistance and anisotropic thermal conductivity (60 W/m·K in the a-direction at 200℃, and only 2.60 W/m·K in the c-direction).

Chemical Inertness: It is resistant to corrosion by acids, alkalis, salts, and organic reagents, and demonstrates non-wetting behavior and no reactivity with most molten metals and semiconductor materials.

Parameter

Properties Unit Value
Density g/cm³ 1.95–2.20
Tensile Strength N/mm² 102
Flexural Strength N/mm² 243
Compressive Strength N/mm² 244
Thermal Conductivity (200°C) W/(m·K) 60 (a) / 2.60 (c)
Thermal Expansion Coefficient (200°C) K⁻¹ 2.0 × 10⁻⁶ (a)
Dielectric Constant (Room Temperature) 5.81
Electrical Resistivity Ω·cm 2.4 × 10¹⁵

Application field solutions

Semiconductor Single Crystal Growth: Used for the growth of III-V compound single crystals such as GaAs (gallium arsenide) and InP (indium phosphide) via VGF (Vertical Gradient Freeze) and LEC (Liquid Encapsulated Czochralski) methods. The high purity and high-temperature deformation resistance of PBN crucibles ensure low defects and high purity of the crystals.
Molecular Beam Epitaxy (MBE): Serves as MBE crucibles for evaporating materials like aluminum (Al) and gallium (Ga) to produce high-end epitaxial wafers such as superlattices and quantum wells. Its high purity and non-wetting property guarantee precise stoichiometry and high quality of the thin-film materials.
OLED Evaporation & Microelectronics: Applied in OLED evaporation source units, featuring high temperature resistance and extremely low outgassing rate, enabling uniform evaporation, extending equipment lifespan, and enhancing display device performance.
High-Temperature Metal Processing & Metallurgy: Used for molten metal transfer and special metallurgy crucibles. Its thermal shock resistance and corrosion resistance make it suitable for processing reactive metals and alloys.
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