High thermal conductivity, good temperature uniformity, good durability in plasma environment, and a coefficient of thermal expansion close to that of silicon
| Performance | Unit | Numerical value |
| Thermal conductivity | W/m·K | 170-230 |
| Maximum operating temperature | ℃ | 1600 |
| Temperature uniformity | ℃ | ±1 |
| Coefficient of thermal expansion | ×10⁻⁶/℃ | 4.0-4.7 |
It is applied to CVD equipment, PECVD equipment, ALD equipment, photolithography equipment and ion implanters
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No. 88, Nanhuan East Road, Yucheng City, Shandong Province