Electrostatic Chuck

The surface of the electrostatic chuck is coated with a pyrolytic boron nitride layer. It is a high-purity, high-temperature-resistant, and corrosion-resistant electrostatic holding device, used for high-temperature handling and processing of semiconductor wafers and precision materials, ensuring stable adsorption without contaminating the samples.

Characteristic

Integrates heating and adsorption functions in one unit

Purity up to 5N (99.999%), with low impurity outgassing

High operating temperature, up to 800°C or higher

Capable of withstanding higher voltage

Parameter

Performance Unit Pyrolytic Boron Nitride (PBN) Alumina (Al₂O₃) Aluminum Nitride (AlN)
Density g/cm³ 2.1 3.8 3.2
Purity % 99.999 99.8 98
Flexural Strength MPa 244 350 400
Thermal Conductivity W/(m·K) 82 (a-axis); 2.4 (c-axis) 20 170
Coefficient of Thermal Expansion ×10⁻⁶ K⁻¹ 2.4 (a-axis); 27 (c-axis) 6.9 4.6
Volume Resistivity Ω·cm 3.6×10¹⁶ 1×10¹⁴ 1.5×10¹³
Dielectric Breakdown Strength kV/mm 200 25 20

Application field solutions

In processes such as etching, thin film deposition, and ion implantation, the CVD electrostatic chuck—integrating heating and adsorption functions—can accurately meet the dual core requirements of “stable fixation + precise temperature control” in high-end manufacturing.

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