High fracture toughness and resistance to mechanical impact
Outstanding thermal shock resistance
High mechanical strength, especially at high temperatures
Low density and high hardness
Wear resistance and corrosion resistance
Self-lubricity
| Property | Unit | Value |
| Crystal Structure | – | Hexagonal system (α, β-phase) |
| Density | g/cm³ | 3.2 – 3.3 |
| Mohs Hardness | – | 8 – 9 |
| Flexural Strength | MPa | 600 – 1000+ |
| Fracture Toughness (KIC) | MPa·m¹/² | 5 – 8 |
| Melting Point/Decomposition Point | °C | Decomposes at 1900°C under atmospheric pressure |
| Maximum Service Temperature | °C | 1200 – 1400 (in air) |
| Thermal Conductivity (20°C) | W/(m·K) | 15 – 30 |
| Coefficient of Thermal Expansion | ×10⁻⁶/K | 3.0 – 3.5 |
| Volume Resistivity (20°C) | Ω·cm | 10¹³ – 10¹⁵ |
| Dielectric Constant (1MHz) | – | 8.0 – 9.5 |
Key components for epitaxy equipment, wafer carrier protective parts, as well as high-temperature insulating components, heat dissipation substrates and plasma etching process protective parts in semiconductor manufacturing.
No. 88, Nanhuan East Road, Yucheng City, Shandong Province
