Point Source

A point source evaporator is a key piece of equipment used in the Physical Vapor Deposition (PVD) process. It evaporates materials from a point-shaped source through local heating, forming a thin film on the substrate. Renowned for its high precision and controllability, this type of evaporator is widely applied in industrial fields requiring fine coatings. Its design is typically based on electron beam or resistance heating principles to ensure a stable and efficient evaporation process.

Characteristic

Excellent Stability: High-quality materials and precision control circuits are adopted to maintain stable evaporation rate and temperature during long-term operation, minimizing process fluctuations.

Superior Uniformity: The point source design enables precise control of evaporation angle and distribution, achieving high uniformity of thin film thickness, which is suitable for high-demand coating applications.

High Material Utilization Rate: The evaporator optimizes the material heating area to reduce waste, with a material utilization rate usually reaching over 80%, lowering production costs.

Strong Compatibility: Supports the evaporation of various materials, including metals, alloys, and compounds, to meet different process requirements.

Parameter

Performance Unit Value
Evaporation Rate Å/s 0.1–10 (adjustable)
Power Range W 100–5000
Temperature Control Precision °C ±1
Material Compatibility / Al, Ag, Mg, Yb, Cu, In, Ga, etc.
Vacuum Requirement mbar Base pressure ≤ 1×10⁻⁶
Service Life / >1000 hours (depending on materials and usage)

Application field solutions

Point source evaporators are widely used in OLED evaporation, CIGS thin film evaporation, perovskite evaporation, and thin film deposition experiments in the scientific research field. Their high-precision characteristics make them particularly suitable for applications requiring nanoscale control.

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