Electrostatic Chuck (ESC) is based on the principle of electrostatic adsorption and consists of an electrode layer, an insulating layer, a substrate, and a temperature-controlled gas channel module. By applying a voltage, it generates an electrostatic field to hold materials in place. It features non-contact clamping, uniform adsorption, compatibility with vacuum and high- or low-temperature environments, and integrated temperature control, making it a core component that replaces mechanical fixtures in high-end manufacturing.
Applications:
Semiconductor Manufacturing：Holds wafers in place, compatible with photolithography, etching, and other processes, improving device yield.
Display Panel Production：Secures substrates and protective films, ensuring precision in OLED and Micro-LED fabrication.
Photovoltaic Manufacturing：Holds silicon wafers or thin-film substrates, supporting coating, cutting, and other processes.
Precision Electronics Processing：Positions miniature chips or ceramic substrates, facilitating high-precision assembly.
Research and Specialized Processing：Secures tiny samples or specialized workpieces for characterization experiments, laser processing, and other applications.
No. 88, Nanhuan East Road, Yucheng City, Shandong Province
